Development of a solderbump technique for contacting a three-dimensional multi electrode array


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Frieswijk, T.A. and Bielen, J.A. and Rutten, W.L.C. (1995) Development of a solderbump technique for contacting a three-dimensional multi electrode array. In: IEEE 17th Annual Conference Engineering in Medicine and Biology Society, Montreal, Canada, 1995.

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Abstract:The application of a solder bump technique for contacting a multi electrode sensor/actuator system is presented. Techniques adapted from the literature could successfully be scaled down to 55×55 ¿m bumps at 120 ¿m heart-to-heart spacing
Item Type:Conference or Workshop Item
Copyright:©1995 IEEE
Faculty:
Electrical Engineering, Mathematics and Computer Science (EEMCS)
Research Group:
Link to this item:http://purl.utwente.nl/publications/17343
Official URL:http://dx.doi.org/10.1109/IEMBS.1995.579531
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Metis ID: 114238