Polymer bonding of micro-machined silicon structures


Besten, C. den and Hal, R.E.G. van and Munoz, J. and Bergveld, P. (1992) Polymer bonding of micro-machined silicon structures. In: IEEE Micro Electro Mechanical Systems, MEMS 1992, 'An Investigation of Micro Structures, Sensors, Actuators, Machines and Robot', Travemunde, Germany (pp. pp. 104-109).

open access
Abstract:Polymer bonding is an indirect bonding technique that can be performed at temperatures of less than 150°C. Thin layers of negative photoresist polyimide and epoxy were used to bond micromachined test devices to other pieces of silicon. The strength of the resulting bond and the influence of primers like APS and HMDS on the bond strength were tested. The best results were achieved with negative photoresist without primer at a curing temperature of 130°C. The bond strength was more than 130 kg/cm2
Item Type:Conference or Workshop Item
Copyright:©1992 IEEE
Research Group:
Link to this item:http://purl.utwente.nl/publications/17269
Official URL:https://doi.org/10.1109/MEMSYS.1992.187699
Export this item as:BibTeX
HTML Citation
Reference Manager


Repository Staff Only: item control page

Metis ID: 114164