Sacrificial wafer bonding: an addition to the micromachining techniques


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Spiering, V.L. and Berenschot, J.W. and Elwenspoek, M.C. and Faase, F.J. (1995) Sacrificial wafer bonding: an addition to the micromachining techniques. In: Third International Symposium on Semiconductor Wafer Bonding, May 21-26, 1995, Reno, Nevada, USA (pp. pp. 642-643).

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Item Type:Conference or Workshop Item
Copyright:© 1995 The Electrochemical Society
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Electrical Engineering, Mathematics and Computer Science (EEMCS)
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Link to this item:http://purl.utwente.nl/publications/17235
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Metis ID: 114130