High Resolution Shadow Mask Patterning In Deep Holes And Its Application To An Electrical Wafer Feed-through


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Burger, G.J. and Smulders, E.J.T. and Berenschot, J.W. and Lammerink, T.S.J. and Fluitman, J.H.J. and Imai, S. (1995) High Resolution Shadow Mask Patterning In Deep Holes And Its Application To An Electrical Wafer Feed-through. In: Transducers '95 - Eurosensors IX: 1995 8th International Conference on Solid-State Sensors and Actuators and Eurosensors IX. Part 1 (of 2), 25-29 June 1995, Stockholm, Sweden (pp. pp. 573-576).

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Abstract:This paper presents a technique to pattern materials in deep holes andor on non-planar substrate surfaces. A rather old technique, E-beam evaporation of metals through a shadow mask, is used [l]. The realisation of high resolution shadow masks using micromachining techniques is described. Further, a low ohmic electrical wafer feed through with a small parasitic capacitance to the substrate and a high placing density is presented.
Item Type:Conference or Workshop Item
Copyright:© 1995 IEEE
Faculty:
Electrical Engineering, Mathematics and Computer Science (EEMCS)
Research Group:
Link to this item:http://purl.utwente.nl/publications/17217
Official URL:http://dx.doi.org/10.1109/SENSOR.1995.717289
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Metis ID: 114112