Materials analysis of fluorocarbon films for MEMS applications


Elders, J. and Jansen, H.V. and Elwenspoek, M. (1994) Materials analysis of fluorocarbon films for MEMS applications. In: IEEE Workshop on Micro Electro Mechanical Systems, MEMS , January 25-28, 1994, Oiso, Japan (pp. pp. 170-175).

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Abstract:In this paper the results of the materials analysis of fluorocarbon (FC) films are presented. The properties of the fluorocarbon films are comparable to those of polytetrafluoroethylene (PTFE), better known under the trademarks such as teflon and fluon. The properties of PTFE are desirable for MEMS applications and enable new designs, new applications and new technological processing routes for microsystems. Therefore, FC films have a tremendous potential for MEMS applications. Furthermore, FC films can easily be deposited via spin coating, e-beam evaporation, in conventional reactive ion etchers and in plasma-enhanced deposition chambers using a carbonhydrotrifluoride plasma facilitating the use of the films for micro electro-mechanical structures. The films deposited in a reactive ion etcher are extremely chemical resistant. The X-ray photoelectron spectroscopy (XPS) analyses results are presented
Item Type:Conference or Workshop Item
Copyright:© 1994 IEEE
Electrical Engineering, Mathematics and Computer Science (EEMCS)
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