Planarization and fabrication of bridges across deep grooves or holes in silicon using a dry film photoresist followed by an etch back

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Spiering, V.L. and Berenschot, J.W. and Elwenspoek, M.C. (1994) Planarization and fabrication of bridges across deep grooves or holes in silicon using a dry film photoresist followed by an etch back. In: 5th Workshop on Micromachining, Micromechanics and Microsystems (MME'94).

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Electrical Engineering, Mathematics and Computer Science (EEMCS)
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Metis ID: 114095