Planarization and fabrication of bridges across deep grooves or holes in silicon using a dry film photoresist followed by an etch back

Spiering, V.L. and Berenschot, J.W. and Elwenspoek, M.C. (1994) Planarization and fabrication of bridges across deep grooves or holes in silicon using a dry film photoresist followed by an etch back. In: 5th Workshop on Micromachining, Micromechanics and Microsystems (MME'94).

Full text not available from this repository. The author is invited to upload the full text of this publication.

Item Type:	Conference or Workshop Item
Faculty:	Electrical Engineering, Mathematics and Computer Science (EEMCS)
Research Group:	Transducers Science and Technology (TST)
Link to this item:	http://purl.utwente.nl/publications/17200
Export this item as:	BibTeX EndNote HTML Citation Reference Manager

Show download statistics for this publication

Repository Staff Only: item control page

Metis ID: 114095