Package stress reduction and low initial stress thanks to deep corrugations
Spiering, V.L. and Burger, J.F. and Elwenspoek, M.C. and Bouwstra, S. (1993) Package stress reduction and low initial stress thanks to deep corrugations. In: 7th International Conference on Solid State, Sensors and Actuators, Transducers '93, June 7-10, 1993, Yokohama, Japan (pp. pp. 44-45).
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|Item Type:||Conference or Workshop Item|
Science and Technology (TNW)
Electrical Engineering, Mathematics and Computer Science (EEMCS)
|Link to this item:||http://purl.utwente.nl/publications/17147|
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