Package stress reduction and low initial stress thanks to deep corrugations

Spiering, V.L. and Burger, J.F. and Elwenspoek, M.C. and Bouwstra, S. (1993) Package stress reduction and low initial stress thanks to deep corrugations. In: 7th International Conference on Solid State, Sensors and Actuators, Transducers '93, June 7-10, 1993, Yokohama, Japan.

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Item Type:	Conference or Workshop Item
Faculty:	Science and Technology (TNW) Electrical Engineering, Mathematics and Computer Science (EEMCS)
Research Group:	Energy, Materials and Systems (EMS) Transducers Science and Technology (TST)
Link to this item:	http://purl.utwente.nl/publications/17147
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