Package stress reduction and low initial stress thanks to deep corrugations

Share/Save/Bookmark

Spiering, V.L. and Burger, J.F. and Elwenspoek, M.C. and Bouwstra, S. (1993) Package stress reduction and low initial stress thanks to deep corrugations. In: 7th International Conference on Solid State, Sensors and Actuators, Transducers '93, June 7-10, 1993, Yokohama, Japan.

Full text not available from this repository. The author is invited to upload the full text of this publication.

Item Type:Conference or Workshop Item
Faculty:
Science and Technology (TNW)
Electrical Engineering, Mathematics and Computer Science (EEMCS)
Research Group:
Link to this item:http://purl.utwente.nl/publications/17147
Export this item as:BibTeX
EndNote
HTML Citation
Reference Manager

 

Repository Staff Only: item control page

Metis ID: 114042