Time dependency of the planarization process in copper chemical mechanical polishing


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Nguyen, V.H. and Timmer, B. and Kranenburg, H. van and Woerlee, P.H. (1999) Time dependency of the planarization process in copper chemical mechanical polishing. In: 29th European Solid-State Device Research Conference, ESSDERC 1999, September 13-15, 1999, Leuven, Belgium (pp. pp. 260-263).

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Item Type:Conference or Workshop Item
Copyright:©1999 IEEE
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Electrical Engineering, Mathematics and Computer Science (EEMCS)
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Link to this item:http://purl.utwente.nl/publications/17018
Official URL:http://ieeexplore.ieee.org/document/1505489/
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Metis ID: 113903