Time Dependency of the Planarization Process in Copper Chemical Mechanical Polishing


Share/Save/Bookmark

Nguyen Hoang, V. and Timmer, B. and Kranenburg, H. van and Woerlee, P.H. (1999) Time Dependency of the Planarization Process in Copper Chemical Mechanical Polishing. In: 29th European Solid-State Device Research Conference, ESSDERC, September 13-15, 1999, Leuven, Belgium (pp. pp. 260-263).

open access
[img]
Preview
PDF
287kB
Item Type:Conference or Workshop Item
Copyright:©1999 IEEE
Research Group:
Link to this item:http://purl.utwente.nl/publications/17018
Export this item as:BibTeX
EndNote
HTML Citation
Reference Manager

 

Repository Staff Only: item control page

Metis ID: 113903