Time Dependency of the Planarization Process in Copper Chemical Mechanical Polishing

Nguyen Hoang, V. and Timmer, B. and Kranenburg van, H. and Woerlee, P.H. (1999) Time Dependency of the Planarization Process in Copper Chemical Mechanical Polishing. In: 29th European Solid-State Device Research Conference, ESSDERC, September 13-15, 1999, Leuven, Belgium.

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Item Type:	Conference or Workshop Item
Copyright:	©1999 IEEE
Research Group:	Biomedical and Environmental Sensor systems (BIOS) Semiconductor Components (SC) Transducers Science and Technology (TST)
Link to this item:	http://purl.utwente.nl/publications/17018
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Metis ID: 113903