On The Electromechanical Behaviour Of Thin Perforated Backplates In Silicon Condenser Microphones

Pedersen, M. and Olthuis, W. and Bergveld, P. (1995) On The Electromechanical Behaviour Of Thin Perforated Backplates In Silicon Condenser Microphones. In: 8th International Conference on Solid-State Sensors and Actuators, 1995 and Eurosensors IX. Transducers, June 25-29, 1995 , Stockholm, Sweden.

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Abstract:	In this work an alternative approach to the modelling of plates with a large number of holes, is presented. By means of plate theory, it is shown that perforated plates can be modelled by conventional orthotropic plates with modified elastic properties. The modification of the elastic constants is derived by equalising the strain-energy of the perforated and the orthotropic plate. The model obtained is then compared with previous methods and applied in the electromechanical simulation of a silicon micromachined microphone structure. The microphone structures are simulated numerically, using an algoritbm based on finite differences.
Item Type:	Conference or Workshop Item
Copyright:	©1995 IEEE
Faculty:	Electrical Engineering, Mathematics and Computer Science (EEMCS)
Research Group:	Biomedical and Environmental Sensor systems (BIOS)
Link to this item:	http://purl.utwente.nl/publications/16890
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