Failure mechanisms of pressurized microchannels, model and experiments


Blom, M.T. and Tas, N.R. and Pandraud, G. and Chmela, E. and Gardeniers, J.G.E. and Elwenspoek, M. and Berg, A. van den and Tijssen, R.P. (2000) Failure mechanisms of pressurized microchannels, model and experiments. In: Thirteenth Annual International Conference on Micro Electro Mechanical Systems, MEMS, January 23-27, 2000, Miyazaki, Japan (pp. pp. 199-204).

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Abstract:Microchannels were created by fusion bonding of a Pyrex and a thermally oxidized silicon wafer. The maximum pressure which can be applied to these channels was investigated. In order to find the relation between this maximum pressure, channel geometry, material elasticity and bond energy, an energy model was developed. It was shown that the model is substantiated by the pressure data, from which it could be calculated that the effective bond energy increased from 0.018 J/m2 to 0.19 J/m2 for an annealing temperature ranging from 310°C to 470°C
Item Type:Conference or Workshop Item
Copyright:© 2000 IEEE
Electrical Engineering, Mathematics and Computer Science (EEMCS)
Science and Technology (TNW)
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