Nanomechanical optical devices fabricated with aligned wafer bonding


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Gui, C. and Veldhuis, G.J. and Koster, T.M. and Lambeck, P.V. and Berenschot, J.W. and Gardeniers, J.G.E. and Elwenspoek, M. (1998) Nanomechanical optical devices fabricated with aligned wafer bonding. In: Eleventh Annual International Workshop on Micro Electro Mechanical Systems, MEMS, 1998, Heidelberg, Germany (pp. pp. 482-487).

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Abstract:This paper reports on a new method for making some types of integrated optical nanomechanical devices. Intensity modulators as well as phase modulators were fabricated using several silicon micromachining techniques, including chemical mechanical polishing and aligned wafer bonding. This new method enables batch fabrication of the nanomechanical optical devices, and enhances their performance.
Item Type:Conference or Workshop Item
Copyright:© 1998 IEEE
Faculty:
Science and Technology (TNW)
Electrical Engineering, Mathematics and Computer Science (EEMCS)
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Link to this item:http://purl.utwente.nl/publications/15873
Official URL:http://dx.doi.org/10.1109/MEMSYS.1998.659805
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