Present and future role of CMP in wafer bonding


Gui, C. and Elwenspoek, M.C. and Gardeniers, J.G.E. and Lambeck, P.V. (1998) Present and future role of CMP in wafer bonding. In: Fourth International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications, Paris, France (pp. pp. 114-126).

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