Present and future role of CMP in wafer bonding

Gui, C. and Elwenspoek, M.C. and Gardeniers, J.G.E. and Lambeck, P.V. (1998) Present and future role of CMP in wafer bonding. In: Fourth International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications, Paris, France.

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Item Type:	Conference or Workshop Item
Faculty:	Electrical Engineering, Mathematics and Computer Science (EEMCS) Science and Technology (TNW)
Research Group:	Transducers Science and Technology (TST) Mesoscale Chemical Systems (MCS)
Link to this item:	http://purl.utwente.nl/publications/15872
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