The surface adhesion parameter: a measure for wafer bondability


Gui, C. and Elwenspoek, M. and Tas, N. and Gardeniers, J.G.E. (1999) The surface adhesion parameter: a measure for wafer bondability. In: Twelfth IEEE International Conference on Micro Electro Mechanical Systems, MEMS , January 17-21, 1999, Orlando, Florida, USA (pp. pp. 290-295).

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Abstract:A theory is presented which describes the initial direct wafer bonding process. The effect of surface microroughness on the bondability is studied on the basis of the theory of contact and adhesion of elastic solids. An effective bonding energy, the maximum of which is the specific surface energy of adhesion, is proposed to describe the real binding energy of the bonding interface including the influence of the wafer surface microroughness. Both the effective bonding energy and the real area of contact between rough surfaces depend on a dimensionless surface adhesion parameter, &thetas;. Using the adhesion parameter as a measure, three kinds of wafer contact interfaces can be identified with respect to their bondability; viz. the non-bonding regime (&thetas;>&ap;12), the bonding regime (&thetas;<&ap;1), and the adherence regime (1<&thetas;<12). Experimental data are in agreement with this theory
Item Type:Conference or Workshop Item
Copyright:© 1999 IEEE
Electrical Engineering, Mathematics and Computer Science (EEMCS)
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