Realization of mechanical decoupling zones for package-stress reduction

Spiering, V.L. and Bouwstra, S. and Fluitman, J.H.J. (1993) Realization of mechanical decoupling zones for package-stress reduction. Sensors and Actuators A: Physical, 37-38 . pp. 800-804. ISSN 0924-4247

Preview

PDF
518Kb

Abstract:	The realization of mechanical decoupling zones around a membrane to reduce package stresses is presented. Wet-isotropic etching with a nitric/fluoridic solution (HNO3/HF/H2O) as well as reactive-ion etching (RIE) with a sulphurhexafluoride/oxygen (SF6/O2) plasma are investigated to realize deep circular grooves. The shape of the cross section of the groove, which determines the shape of the decoupling zone, can be controlled using the RIE method by changing the etch conditions. It is shown that a large undercut at low pressures as well as a small undercut at high pressures is possible with a SF6/O2 plasma, leading to round or steep sidewalls of the grooves, respectively. Finally a completed bare structure containing a membrane and a surrounding decoupling zone is presented.
Item Type:	Article
Copyright:	© 1993 Elsevier Science
Research Group:	Transducers Science and Technology (TST)
Link to this item:	http://purl.utwente.nl/publications/15247
Official URL:	http://dx.doi.org/10.1016/0924-4247(93)80135-4
Export this item as:	BibTeX EndNote HTML Citation Reference Manager

Show download statistics for this publication

Repository Staff Only: item control page

Metis ID: 112122