On-chip decoupling zone for package-stress reduction

Spiering, Vincent L. and Bouwstra, Siebe and Spiering, Ruud M.E.J. (1993) On-chip decoupling zone for package-stress reduction. Sensors and Actuators A: Physical, 39 (2). pp. 149-157. ISSN 0924-4247

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Abstract:	A mathematical analysis is presented of the reduction of package stresses by introducing an on-chip decoupling zone. Different configurations of the zones are compared, using the finite-element method (FEM) and analytical models. A reduction of several orders of magnitude is obtained when a deep and thin axisymmetrical corrugation with a V-shaped cross section (a V-zone) is applied as the decoupling zone. Approximate expressions for the stiffness and the force reduction are derived. The application of a membrane pressure sensor with a V-zone as decoupling zone is evaluated. It is shown that the sensitivity of the sensor is not reduced by the addition of the V-zone.
Item Type:	Article
Copyright:	© 1993 Elsevier Science
Research Chair:	Structural Dynamics and Acoustics (SD&A)
Research Group:	Transducers Science and Technology (TST) Applied Mechanics (AM)
Link to this item:	http://purl.utwente.nl/publications/15246
Official URL:	http://dx.doi.org/10.1016/0924-4247(93)80212-Y
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