Membranes fabricated with a deep single corrugation for package stress reduction and residual stress relief

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Spiering, V.L. and Bouwstra, S. and Burger, J.F. and Elwenspoek, M. (1993) Membranes fabricated with a deep single corrugation for package stress reduction and residual stress relief. Journal of Micromechanics and Microengineering, 3 (4). pp. 243-246. ISSN 0960-1317

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Abstract:Thin square membranes including a deep circular corrugation are realized and tested for application in a strain-based pressure sensor. Package-induced stresses are reduced and relief of the residual stress is obtained, resulting in a large pressure sensitivity and a reduced temperature sensitivity. Finite element method simulations were carried out, showing that the pressure-deflection behaviour of the structure is close to that of a circular membrane with clamped edge but free radial motion.
Item Type:Article
Copyright:© 1993 IEEE
Faculty:
Science and Technology (TNW)
Electrical Engineering, Mathematics and Computer Science (EEMCS)
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Link to this item:http://purl.utwente.nl/publications/15245
Official URL:http://dx.doi.org/10.1088/0960-1317/3/4/020
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