Fabrication of nanomechanical optical devices with aligned wafer bonding


Gui, C. and Veldhuis, G.J. and Koster, T.M. and Lambeck, P.V. and Berenschot, J.W. and Gardeniers, J.G.E. and Elwenspoek, M. (1999) Fabrication of nanomechanical optical devices with aligned wafer bonding. Microsystem Technologies, 5 (3). pp. 138-143. ISSN 0946-7076

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Abstract:This paper reports on a new method for making some types of integrated optical nanomechanical devices. Intensity modulators as well as phase modulators were fabricated using several silicon micromachining techniques, including chemical mechanical polishing and aligned wafer bonding. This new method enables batch fabrication of the nanomechanical optical devices, and enhances their performance.
Item Type:Article
Copyright:© Springer 1999
Science and Technology (TNW)
Electrical Engineering, Mathematics and Computer Science (EEMCS)
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Link to this item:http://purl.utwente.nl/publications/15200
Official URL:https://doi.org/10.1007/s005420050153
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Metis ID: 112075