Wet and dry etching techniques for the release of sub-micrometre perforated membranes

Kuiper, Stein and Boer de, Meint and Rijn van, Cees and Nijdam, Wietze and Krijnen, Gijs and Elwenspoek, Miko (2000) Wet and dry etching techniques for the release of sub-micrometre perforated membranes. Journal of Micromechanics and Microengineering, 10 (2). pp. 171-174. ISSN 0960-1317

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Abstract:	For the production of microsieves we studied the release of perforated silicon nitride membranes from a silicon substrate. During the release by KOH etching the pressure build-up due to hydrogen gas formation can be quite large and cause rupture of the membrane. We explored the use of anisotropic etching with an SF6/O2 plasma to replace KOH etching. For sub-micrometre pores excellent results were obtained.
Item Type:	Article
Copyright:	© Institute of Physics and IOP Publishing Limited 2000
Faculty:	Electrical Engineering, Mathematics and Computer Science (EEMCS)
Research Group:	Transducers Science and Technology (TST)
Link to this item:	http://purl.utwente.nl/publications/14631
Official URL:	http://dx.doi.org/10.1088/0960-1317/10/2/312
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