Wet and dry etching techniques for the release of sub-micrometre perforated membranes

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Kuiper, Stein and Boer de, Meint and Rijn van, Cees and Nijdam, Wietze and Krijnen, Gijs and Elwenspoek, Miko (2000) Wet and dry etching techniques for the release of sub-micrometre perforated membranes. Journal of Micromechanics and Microengineering, 10 (2). pp. 171-174. ISSN 0960-1317

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Abstract:For the production of microsieves we studied the release of perforated silicon nitride membranes from a silicon substrate. During the release by KOH etching the pressure build-up due to hydrogen gas formation can be quite large and cause rupture of the membrane. We explored the use of anisotropic etching with an SF6/O2 plasma to replace KOH etching. For sub-micrometre pores excellent results were obtained.
Item Type:Article
Copyright:© Institute of Physics and IOP Publishing Limited 2000
Faculty:
Electrical Engineering, Mathematics and Computer Science (EEMCS)
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Link to this item:http://purl.utwente.nl/publications/14631
Official URL:http://dx.doi.org/10.1088/0960-1317/10/2/312
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