High resolution shadow mask patterning in deep holes and its application to an electrical wafer feed-through

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Burger, G.J. and Smulders, E.J.T. and Berenschot, J.W. and Lammerink, T.S.J. and Fluitman, J.H.J. and Imai, S. (1996) High resolution shadow mask patterning in deep holes and its application to an electrical wafer feed-through. Sensors and Actuators A: Physical, 54 (1-3). pp. 669-673. ISSN 0924-4247

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Abstract:The paper presents a technique to pattern materials in deep holes and/or on non-planar substrate surfaces. A rather old technique, namely, electron-beam evaporation of metals through a shadow mask, is used. The realization of high-resolution shadow masks using micromachining techniques is described. Further, a low ohmic electrical wafer foed-through with a small parasitic capacitance to the substrate and a high placing density is presented.
Item Type:Article
Copyright:© 1996 Elsevier Science
Faculty:
Electrical Engineering, Mathematics and Computer Science (EEMCS)
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Link to this item:http://purl.utwente.nl/publications/14201
Official URL:http://dx.doi.org/10.1016/S0924-4247(97)80035-0
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