The electrical characterization of grain boundaries in ultra-fine grained Y-TZP

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Chen, C.S. and Boutz, M.M.R. and Boukamp, B.A. and Winnubst, A.J.A. and Vries, K.J. de (1993) The electrical characterization of grain boundaries in ultra-fine grained Y-TZP. Materials Science and Engineering A: Structural materials, 168 (2). pp. 231-234. ISSN 0025-5416

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Abstract:Starting from a sinter reactive powder prepared by a gel precipitation technique, dense, ultra-fine grained (100–200 nm) yttria stabilized tetragonal zirconia ceramics were obtained by sinter forging at a temperature of 1100 °C or by pressureless sintering at 1150 °C. The pressureless sintered compacts were subjected to further heat treatments at temperatures of 1250–1450 °C or compressive deformation at 1250 °C under uniaxial stresses of 20–100 MPa. The obtained samples were characterized mainly by impedance spectroscopy. After compressive deformation a decrease in grain boundary resistivity was found which increased with applied stress. This can be interpreted in terms of a decrease in impurity segregation and a partial removal by compressive deformation of a poorly conducting amorphous film around the grains. It was also found that the grain boundary resistivity of samples sintered at 1150 °C could be considerably reduced by further pressureless heat treatments at temperatures above 1250 °C. This effect is probably owing to dewetting of the grain boundary and dissolution of grain boundary impurities into the bulk of the grains.
Item Type:Article
Copyright:© 1993 Elsevier Science
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Science and Technology (TNW)
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Link to this item:http://purl.utwente.nl/publications/12659
Official URL:http://dx.doi.org/10.1016/0921-5093(93)90732-T
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